Journal of
Systemics, Cybernetics and Informatics
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ISSN: 1690-4524 (Online)


Peer Reviewed Journal via three different mandatory reviewing processes, since 2006, and, from September 2020, a fourth mandatory peer-editing has been added.

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Published by
The International Institute of Informatics and Cybernetics


Re-Published in
Academia.edu
(A Community of about 40.000.000 Academics)


Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Quality Assurance

Editors

Journal's Reviewers
Call for Special Articles
 

Description and Aims

Submission of Articles

Areas and Subareas

Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


Education 5.0: Using the Design Thinking Process – An Interdisciplinary View
Birgit Oberer, Alptekin Erkollar
(pages: 1-17)

Impact of Artificial Intelligence on Smart Cities
Mohammad Ilyas
(pages: 18-39)

A Multi-Disciplinary Cybernetic Approach to Pedagogic Excellence
Russell Jay Hendel
(pages: 40-63)

Data Management Sharing Plan: Fostering Effective Trans-Disciplinary Communication in Collaborative Research
Cristo Ernesto Yáñez León, James Lipuma
(pages: 64-79)

From Disunity to Synergy: Transdisciplinarity in HR Trends
Olga Bernikova, Daria Frolova
(pages: 80-92)

The Impact of Artificial Intelligence on the Future Business World
Hebah Y. AlQato
(pages: 93-104)

Wi-Fi and the Wisdom Exchange: The Role of Lived Experience in the Age of AI
Teresa H. Langness
(pages: 105-113)

Older Adult Online Learning during COVID-19 in Taiwan: Based on Teachers' Perspective
Ya-Hui Lee, Yi-Fen Wang, Hsien-Ta Cha
(pages: 114-129)

Data Visualization of Budgeting Assumptions: An Illustrative Case of Trans-disciplinary Applied Knowledge
Carol E. Cuthbert, Noel J. Pears, Karen Bradshaw
(pages: 130-149)

The Importance of Defining Cybersecurity from a Transdisciplinary Approach
Bilquis Ferdousi
(pages: 150-164)

ChatGPT, Metaverses and the Future of Transdisciplinary Communication
Jasmin (Bey) Cowin
(pages: 165-178)

Trans-Disciplinary Communication for Policy Making: A Reflective Activity Study
Cristo Leon
(pages: 179-192)

Trans-Disciplinary Communication in Collaborative Co-Design for Knowledge Sharing
James Lipuma, Cristo Leon
(pages: 193-210)

Digital Games in Education: An Interdisciplinary View
Birgit Oberer, Alptekin Erkollar
(pages: 211-230)

Disciplinary Inbreeding or Disciplinary Integration?
Nagib Callaos
(pages: 231-281)


 

Abstracts

 


ABSTRACT


Integrated Design Validation: Combining Simulation and Formal Verification for Digital Integrated Circuits

Lun Li, Mitchell Thornton, Stephen Szygenda


The correct design of complex hardware continues to challenge engineers. Bugs in a design that are not uncovered in early design stages can be extremely expensive. Simulation is a predominantly used tool to validate a design in industry. Formal verification overcomes the weakness of exhaustive simulation by applying mathematical methodologies to validate a design. The work described here focuses upon a technique that integrates the best characteristics of both simulation and formal verification methods to provide an effective design validation tool, referred as Integrated Design Validation (IDV). The novelty in this approach consists of three components, circuit complexity analysis, partitioning based on design hierarchy, and coverage analysis. The circuit complexity analyzer and partitioning decompose a large design into sub-components and feed sub-components to different verification and/or simulation tools based upon known existing strengths of modern verification and simulation tools. The coverage analysis unit computes the coverage of design validation and improves the coverage by further partitioning. Various simulation and verification tools comprising IDV are evaluated and an example is used to illustrate the overall validation process. The overall process successfully validates the example to a high coverage rate within a short time. The experimental result shows that our approach is a very promising design validation method.

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