Journal of
Systemics, Cybernetics and Informatics
 



ISSN: 1690-4524 (Online)


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Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Editors

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Description and Aims

Submission of Articles

Areas and Subareas

Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


Detection of Minimal Set of Trips Causing the Necessity to Use Extra Vehicle for Vehicle Scheduling Problem
Katerina Pastircáková, Jaromír Šulc
(pages: 1-4)

Key Factors in the Success of Self - Directed Learning of Military Personnel - Taking Smartphone as an Example
Yen-Hsi Lo, Yen-Fen Lo, Po-Yun Chiang, Jung Hsiao
(pages: 5-8)

Machine Learning Based IP Network Traffic Classification Using Feature Significance Analysis
Te-Shun Chou, John Pickard, Ciprian Popoviciu
(pages: 9-12)

The Information System for US Stock Market: Fundamental and Technical Analysis
Sergejs Hilkevics, Galina Hilkevica
(pages: 13-24)

The Impact of Environmental and Social Performance on the Market Value of Shares of Czech Joint-Stock Corporations
Alena Kocmanova, Marie Pavlakova Docekalova, Iveta Simberova
(pages: 25-31)

Play the Game! Analogue Gamification for Raising Information Security Awareness (Invited Paper)
Margit Scholl
(pages: 32-35)

Using Informatics and Technology Practices for Academic Performance Review
Kim Moorning
(pages: 36-41)

Multiple Research Perspectives as a Paradigm to Co-Create Meaningful Real-life Experiences
Jan Detand, Marina Emmanouil
(pages: 42-46)

A Methodology to Integrate Regulatory Expertise, Research and Education to Accelerate Biomedical Device Translation
Diana Easton
(pages: 47-52)

Active Learning through Smart Grid Model Site in Challenge Based Learning Course
Ellen A. Kalinga, Kwame S. Ibwe, Nerey H. Mvungi, Hannu Tenhunen
(pages: 53-64)

Non-Linear Static Analysis of Masonry Buildings under Seismic Actions
Maria Luisa Beconcini, Paolo Cioni, Pietro Croce, Paolo Formichi, Filippo Landi, Caterina Mochi
(pages: 65-70)

Toward an Engaging Hands-on Environment for a Beginning Networking and Security Class
Lopamudra Roychoudhuri
(pages: 71-76)

Designing Representations, Affecting Reality: A Meta-Model Proposal to Address the Question of Design Epistemology from the Perspective of Cognitive Science
Andrea Zammataro
(pages: 77-80)

Dielectrophoretic Movement of Cell around Surface Electrodes in Flow Channel
Yusuke Takahashi, Shigehiro Hashimoto, Manabu Watanabe
(pages: 81-87)


 

Abstracts

 


ABSTRACT


Image Processor Using 3D-DWT as Part of Health Care Management System

Kyung-Chang Park, Yun-Ki Hong, Sang-Jin Lee, Yeon-Ho Kim, Younggap You, Tae Won Cho, Kyoung-Rok Cho, Kamran Eshraghian


This paper presents a low power and high speed 3D-DWT (three-dimensional discrete wavelet transform) architecture using stacked silicon dies for image compression of medical images. The interconnections of stacked chips are based on TSV (through silicon via) techniques. Its low power operation is due to short signal paths between layers. The area of 3D architecture is much smaller than that of 2D counterpart having the same performance. Each circuit/system layer can be optimized since it can be fabricated using a different technology. The 3D-DWT architecture consists of two processing elements (PE): a PE-odd (processing elements-odd) and a PE-even (processing elements-even) layer. Each layer processes pixel data derived from rows of the y axis, scanning from left to right side of the image data. Each layer operates in parallel yielding high throughput. The architecture can be used to compress medical image such as X-ray, MRI, NRI, CT and endoscopy by processing images frame by frame.

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