Journal of
Systemics, Cybernetics and Informatics
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ISSN: 1690-4524 (Online)


Peer Reviewed Journal via three different mandatory reviewing processes, since 2006, and, from September 2020, a fourth mandatory peer-editing has been added.

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Published by
The International Institute of Informatics and Cybernetics


Re-Published in
Academia.edu
(A Community of about 40.000.000 Academics)


Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Quality Assurance

Editors

Journal's Reviewers
Call for Special Articles
 

Description and Aims

Submission of Articles

Areas and Subareas

Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


Education 5.0: Using the Design Thinking Process – An Interdisciplinary View
Birgit Oberer, Alptekin Erkollar
(pages: 1-17)

Impact of Artificial Intelligence on Smart Cities
Mohammad Ilyas
(pages: 18-39)

A Multi-Disciplinary Cybernetic Approach to Pedagogic Excellence
Russell Jay Hendel
(pages: 40-63)

Data Management Sharing Plan: Fostering Effective Trans-Disciplinary Communication in Collaborative Research
Cristo Ernesto Yáñez León, James Lipuma
(pages: 64-79)

From Disunity to Synergy: Transdisciplinarity in HR Trends
Olga Bernikova, Daria Frolova
(pages: 80-92)

The Impact of Artificial Intelligence on the Future Business World
Hebah Y. AlQato
(pages: 93-104)

Wi-Fi and the Wisdom Exchange: The Role of Lived Experience in the Age of AI
Teresa H. Langness
(pages: 105-113)

Older Adult Online Learning during COVID-19 in Taiwan: Based on Teachers' Perspective
Ya-Hui Lee, Yi-Fen Wang, Hsien-Ta Cha
(pages: 114-129)

Data Visualization of Budgeting Assumptions: An Illustrative Case of Trans-disciplinary Applied Knowledge
Carol E. Cuthbert, Noel J. Pears, Karen Bradshaw
(pages: 130-149)

The Importance of Defining Cybersecurity from a Transdisciplinary Approach
Bilquis Ferdousi
(pages: 150-164)

ChatGPT, Metaverses and the Future of Transdisciplinary Communication
Jasmin (Bey) Cowin
(pages: 165-178)

Trans-Disciplinary Communication for Policy Making: A Reflective Activity Study
Cristo Leon
(pages: 179-192)

Trans-Disciplinary Communication in Collaborative Co-Design for Knowledge Sharing
James Lipuma, Cristo Leon
(pages: 193-210)

Digital Games in Education: An Interdisciplinary View
Birgit Oberer, Alptekin Erkollar
(pages: 211-230)

Disciplinary Inbreeding or Disciplinary Integration?
Nagib Callaos
(pages: 231-281)


 

Abstracts

 


ABSTRACT


New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response)

El-Sayed A. El-Badawy, Farag Z. El-Halafawy, Hamdy A. Kelash, Ashraf M. Abou-Tabl


Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD) and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed) of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton). Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

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