Detection of Defects of BGA by Tomography Imaging
Tetsuhiro SUMIMOTO, Toshinori MARUYAMA, Yoshiharu AZUMA, Sachiko GOTO, Munehiro MONDOU, Noboru FURUKAWA, Saburo OKADA
To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridges, missing connections, solder voids, open connections and miss-registrations of parts. As we can find mostly solder bridges in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on the X-ray image data. We attempt to detect the characteristics of the defects of BGA based on an image analysis. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. Besides, in order to get information in detail of an abnormal BGA, we tried to capture the tomographic images utilizing the latest imaging techniques.