Journal of
Systemics, Cybernetics and Informatics
HOME   |   CURRENT ISSUE   |   PAST ISSUES   |   RELATED PUBLICATIONS   |   SEARCH     CONTACT US
 



ISSN: 1690-4524 (Online)


Peer Reviewed Journal via three different mandatory reviewing processes, since 2006, and, from September 2020, a fourth mandatory peer-editing has been added.

Indexed by
DOAJ (Directory of Open Access Journals)Benefits of supplying DOAJ with metadata:
  • DOAJ's statistics show more than 900 000 page views and 300 000 unique visitors a month to DOAJ from all over the world.
  • Many aggregators, databases, libraries, publishers and search portals collect our free metadata and include it in their products. Examples are Scopus, Serial Solutions and EBSCO.
  • DOAJ is OAI compliant and once an article is in DOAJ, it is automatically harvestable.
  • DOAJ is OpenURL compliant and once an article is in DOAJ, it is automatically linkable.
  • Over 95% of the DOAJ Publisher community said that DOAJ is important for increasing their journal's visibility.
  • DOAJ is often cited as a source of quality, open access journals in research and scholarly publishing circles.
JSCI Supplies DOAJ with Meta Data
, Academic Journals Database, and Google Scholar


Listed in
Cabell Directory of Publishing Opportunities and in Ulrich’s Periodical Directory


Published by
The International Institute of Informatics and Cybernetics


Re-Published in
Academia.edu
(A Community of about 40.000.000 Academics)


Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Quality Assurance

Editors

Journal's Reviewers
Call for Special Articles
 

Description and Aims

Submission of Articles

Areas and Subareas

Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


Transdisciplinary Communication as a Meta-Framework of Digital Education
Rusudan Makhachashvili, Ivan Semenist
(pages: 1-6)

Multidisciplinary Learning Using Online Networking in Biomedical Engineering
Shigehiro Hashimoto
(pages: 7-12)

Augmented Intelligence for Advancing Healthcare
Mohammad Ilyas
(pages: 13-19)

A Transdisciplinary Approach to Refereeal
Russell Jay Hendel
(pages: 20-25)

The Impact of Convictions on Interlocking Systems
Teresa Henkle Langness
(pages: 26-33)

Collaborative Convergence: Finding the Language for Trans-Disciplinary Communication to Occur
Cristo Leon, James Lipuma
(pages: 34-37)

Bridging the Gap Between the World of Education and the World of Business via Standards to Develop Competences of the Future at Universities
Paweł Poszytek
(pages: 38-42)

Multidisciplinary Learning for Multifaceted Thinking in Globalized Society
Shigehiro Hashimoto
(pages: 43-48)

From Spirituality to Technontology in Education
Florent Pasquier
(pages: 49-52)

Differentiated Learning and Digital Game Based Learning: The KIDEDU Project
Eleni Tsami
(pages: 53-57)

Emerging Role of Artificial Intelligence
Mohammad Ilyas
(pages: 58-65)

Practicing Transdisciplinarity and Trans-Domain Approaches in Education: Theory of and Communication in Values and Knowledge Education (VaKE)
Jean-Luc Patry
(pages: 66-71)

Reflexive Practice for Inter and Trans Disciplinary Research in the Third Millennium
Maria Grazia Albanesi
(pages: 72-76)


 

Abstracts

 


ABSTRACT


Detection of Defects of BGA by Tomography Imaging

Tetsuhiro SUMIMOTO, Toshinori MARUYAMA, Yoshiharu AZUMA, Sachiko GOTO, Munehiro MONDOU, Noboru FURUKAWA, Saburo OKADA


To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridges, missing connections, solder voids, open connections and miss-registrations of parts. As we can find mostly solder bridges in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on the X-ray image data. We attempt to detect the characteristics of the defects of BGA based on an image analysis. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. Besides, in order to get information in detail of an abnormal BGA, we tried to capture the tomographic images utilizing the latest imaging techniques.

Full Text