Journal of
Systemics, Cybernetics and Informatics
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ISSN: 1690-4524 (Online)


Peer Reviewed Journal via three different mandatory reviewing processes, since 2006, and, from September 2020, a fourth mandatory peer-editing has been added.

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Published by
The International Institute of Informatics and Cybernetics


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Academia.edu
(A Community of about 40.000.000 Academics)


Honorary Editorial Advisory Board's Chair
William Lesso (1931-2015)

Editor-in-Chief
Nagib C. Callaos


Sponsored by
The International Institute of
Informatics and Systemics

www.iiis.org
 

Editorial Advisory Board

Quality Assurance

Editors

Journal's Reviewers
Call for Special Articles
 

Description and Aims

Submission of Articles

Areas and Subareas

Information to Contributors

Editorial Peer Review Methodology

Integrating Reviewing Processes


A Transdisciplinary Approach to Enhancing Online Engineering Education Through Learning Analytics
Masikini Lugoma, Lethuxolo Yende, Pule Dikgwatlhe, Akhona Mkonde, Rorisang Thage, Lucky Maseko, Ngonidzashe Chimwani
(pages: 1-6)

AI Disruptions in Higher Education: Evolutionary Change, Not Revolutionary Overthrow
Cristo Leon, James Lipuma, Maximus Rafla
(pages: 7-18)

Education, Research, and Methodology: A Transdisciplinary Cybernetic Whole
Nagib Callaos, Cristo Leon
(pages: 19-33)

Enhancing Educational Effectiveness Through Transdisciplinary Practice: The ETCOP Model
Birgit Oberer, Alptekin Erkollar, Andreas Kropfberger
(pages: 34-40)

From Instruction to Interaction: Reflexive Learning Design for Cross-Generational Engagement at the Workplace
Gita Aulia Nurani, Ya-Hui Lee
(pages: 41-44)

GIS in Aquatic Animal Health Surveillance: A Transdisciplinary eLearning Initiative Integrating Education, Research, and Methodology (The Aquae Strength Project)
Eleonora Franzago, Rodrigo Macario, Matteo Mazzucato, Federica Sbettega, Manuela Cassani, Guido Ricaldi, Francesco Bissoli, Anna Nadin, Fabrizio Personeni, Manuela Dalla Pozza, Grazia Manca, Nicola Ferré
(pages: 45-50)

Reflexivity as a Compass: The European AI Act and Its Implications for U.S. Higher Education Institutions
Jasmin Cowin
(pages: 51-56)

Required General Education Program Evaluation: Bridging the Gap Between Educators and Administrators
James Lipuma, Cristo Leon, Jeremy Reich
(pages: 57-61)

Researching Ourselves
Jeremy Horne
(pages: 62-72)

The Self-Aware, Reflective Learner: Fostering Metacognitive Awareness and Reflexivity in Undergraduates Through Service-Learning
Genejane Adarlo
(pages: 73-81)


 

Abstracts

 


ABSTRACT


New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response)

El-Sayed A. El-Badawy, Farag Z. El-Halafawy, Hamdy A. Kelash, Ashraf M. Abou-Tabl


Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD) and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed) of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton). Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

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