Journal of
Systemics, Cybernetics and Informatics

ISSN: 1690-4524 (Online)

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Editorial Advisory Board's Chair
William Lesso

Nagib C. Callaos

Sponsored by
The International Institute of
Informatics and Systemics

Editorial Advisory Board


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No Warranty Express or Implied: Why Do We Have So Many Problems With the Computer Systems That Pervade Our Lives?
John W. Coffey
(pages: 1-6)

Can You Hear Me Now? An Innovative Approach to Assess and Build Connections with Online Learner’s
Tina M. Serafini, Risa Blair
(pages: 7-11)

End-to-end Security with Translation
Kevin E. Foltz
(pages: 12-17)

(Assistive) Technology at the Point of Instruction: Barriers and Possibilities
Lorayne Robertson
(pages: 18-24)

Supplementing Multiple Modalities and Universal Design in Learning with Goal-Setting
Russell Jay Hendel
(pages: 25-30)

Experts Informing Experts
Robert Hammond
(pages: 31-35)

Internet of Things – A New Epistemic Object
Rolf Dornberger, Terry Inglese, Safak Korkut
(pages: 36-44)

An Experiment in Interdisciplinary STEM Education: Insights from the Catholic Intellectual Tradition
Fr. Joseph R. Laracy, Thomas Marlowe, Fr. Gerald J. Buonopane
(pages: 45-53)

Big History Understanding of Complexity, Informatics and Cybernetics
John L. Motloch
(pages: 54-60)

Flourishing Organizations
Maria Jakubik
(pages: 61-72)

Pros & Cons of Smart ICT in Some Governmental Applications
Dusan Soltes
(pages: 73-75)

Information Exchange in Vehicles Ad-Hock Networks
Tomas Zelinka
(pages: 76-80)

Living in a Digital World: Improving Skills to Meet the Challenges of Digital Transformation Through Authentic and Game-Based Learning
Margit Scholl, Frauke Fuhrmann
(pages: 81-86)

Psychotherapy via the Internet as a Novel Tool for Clinical Use
Ulrich Sprick
(pages: 87-94)

Technology Intercepts for Cyber Security Applied to Critical Infrastructures
Mario La Manna
(pages: 95-100)

“And Then a Miracle Occurs …” – Engaging the Challenge of Operationalizing Theories of Success in Digital Transformation
Michael Von Kutzschenbach
(pages: 101-105)

Multidisciplinary Learning Extends Communication Skill, and Helps Cross Cultural Understandings: Biomedical Engineering
Shigehiro Hashimoto
(pages: 106-112)

Integrating Teaching, Research and Problem Solving: An Experience in Progress in the Mucuri Valley Region (Brazil)
Leônidas Conceição Barroso
(pages: 113-118)

Meeting Learning Challenges in Product Design Education with and through Additive Manufacturing
William Lavatelli Kempton, Steinar Killi, Andrew Morrison
(pages: 119-129)

Creating and Using Symbolic Mental Structures via Piaget’s Constructivism and Popper’s Three Worlds View with Falsifiability to Achieve Critical Thinking by Students in the Physical Sciences
Matthew E. Edwards
(pages: 130-134)

Creativity in Higher Education: Comparative Genetic Analyses on the Dopaminergic System in Relation to Creativity, Addiction, Schizophrenia in Humans and Non-Human Primates
Bernard Wallner, Sonja Windhager, Katrin Schaefer, Martin Fieder
(pages: 135-142)





New Architecture of Optical Interconnect for High-Speed Optical Computerized Data Networks (Nonlinear Response)

El-Sayed A. El-Badawy, Farag Z. El-Halafawy, Hamdy A. Kelash, Ashraf M. Abou-Tabl

Although research into the use of optics in computers has increased in the last and current decades, the fact remains that electronics is still superior to optics in almost every way. Research into the use of optics at this stage mirrors the research into electronics after the 2nd World War. The advantages of using fiber optics over wiring are the same as the argument for using optics over electronics in computers. Even through totally optical computers are now a reality, computers that combine both electronics and optics, electro-optic hybrids, have been in use for some time. In the present paper, architecture of optical interconnect is built up on the bases of four Vertical-Cavity Surface- Emitting Laser Diodes (VCSELD) and two optical links where thermal effects of both the diodes and the links are included. Nonlinear relations are correlated to investigate the power-current and the voltage-current dependences of the four devices. The good performance (high speed) of the interconnect is deeply and parametrically investigated under wide ranges of the affecting parameters. The high speed performance is processed through three different effects, namely the device 3-dB bandwidth, the link dispersion characteristics, and the transmitted bit rate (soliton). Eight combinations are investigated; each possesses its own characteristics. The best architecture is the one composed of VCSELD that operates at 850 nm and the silica fiber whatever the operating set of causes. This combination possesses the largest device 3-dB bandwidth, the largest link bandwidth and the largest soliton transmitted bit rate. The increase of the ambient temperature reduces the high-speed performance of the interconnect

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